| Autor: |
Ito, Yuka, Terada, Shinsuke, Arai, Shinya, Choki, Koji, Fukushima, Takafumi, Koyangi, Mitsumasa |
| Zdroj: |
2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International; 1/ 1/2011, p1-4, 4p |
| Abstrakt: |
This paper presents optical interconnection for module-to-module length for high-performance computing system. A new multi-chip transceiver module consisting of optical components, IC chips, flexible printed circuits (FPCs), and a sheet of optical polynorbornene (PNB) waveguides was fabricated by simple packaging processes. Waveguide sheet with micromirrors and the FPCs mounting of O/E devices were completed independently. After that, the waveguide sheet was aligned to optical devices on FPCs passively. Optical loss for waveguide including propagation and micromirror couplings was 3.30 dB. We successfully demonstrate high-bandwidth 100-Gbps (12.5 Gbps/ch × 8 channels) data transmission with the module, on which two 4-channel vertical-cavity surface emitting laser (VCSEL) arrays, one VCSEL driver (VD), two 4-channel PD arrays, and one transimpedance amplifier/limiting amplifier (TIA/LA) were mounted. [ABSTRACT FROM PUBLISHER] |
| Databáze: |
Complementary Index |
| Externí odkaz: |
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