| Autor: |
Nakahira, Kota, Endo, Fumiaki, Furuya, Ryosuke, Suzuki, Ken, Miura, Hideo |
| Zdroj: |
2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International; 1/ 1/2011, p1-6, 6p |
| Abstrakt: |
Since the residual stress in a silicon chip mounted in 3D modules causes the degradation of both electrical and mechanical reliability, the dominant factors of the residual stress was investigated by using a finite element method and experiments applying 2-μm long piezoresistance strain gauges. The residual stress and local deformation of the chip were found to vary drastically depending on the mechanical properties of bumps and underfill and bump alignment structures. [ABSTRACT FROM PUBLISHER] |
| Databáze: |
Complementary Index |
| Externí odkaz: |
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