| Autor: |
Brun, Christophe, Franck, Pierre, Yap Chin Chong, Tan, Dunlin, Teo Hang Tong, Edwin, Bila, Stephane, Baillargeat, Dominique, Tay, Beng Kang |
| Zdroj: |
2011 IEEE 13th Electronics Packaging Technology Conference; 1/ 1/2011, p158-162, 5p |
| Abstrakt: |
In this paper, carbon nanotube models for high-frequency interconnect applications are studied applying electromagnetic and circuit approaches. A first validation of both models gives a better understanding of carbon nanotubes behaviors in RF. The complex surface impedance used in this paper is derived from Hanson's conductivity in order to take in consideration the quantum capacitance and all other components existing in nano-scale world. A study of CNT inter-coupling is then possible within a transmission line configuration above a ground plane. In future devices, nano-interconnect based on CNTs will be gathered within bundles, a better comprehension of coupling inside and around this bundle allows developing complex CNT bundle models. A RF device approach using CNT bundle models is brought at the end of this paper. [ABSTRACT FROM PUBLISHER] |
| Databáze: |
Complementary Index |
| Externí odkaz: |
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