| Autor: |
Spinola Durante, G., Jose James, R., Bosshard, C., Muller, C., Baborowski, J., Pezous, A., Cardot, F., Dubois, M.-A., Neels, A., Dommann, A. |
| Zdroj: |
18th European Microelectronics & Packaging Conference; 1/ 1/2011, p1-6, 6p |
| Abstrakt: |
Reliable hermetic MEMS chip-scale packaging has been developed and tested with gold-tin soldering on 2×1.5 mm2 chips. The test vehicle configuration consists of a glass cap with AuSn solder ring bonded onto a silicon resonator dummy chip. Through careful chip layout, UBM layer improvements and soldering process optimization, the shear tests yielded forces above 5 kg on a bonding ring area of ∼0.5 mm2. With a resulting shear stress larger than 100 MPa it is now possible to address a wider application domain for vacuum-encapsulated MEMS, where highly reliable hermetic solutions are required. Promising applications of hermetic and reliable MEMS are found in the medical field and in the space domain where defect-free sealing is a must. In the consumer electronics domain, where time-to-market and cost reduction are key factors, development time can be shortened for extremely miniaturized packaged MEMS. [ABSTRACT FROM PUBLISHER] |
| Databáze: |
Complementary Index |
| Externí odkaz: |
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