A low temperature wafer-level hermetic MEMS package using UV curable adhesive.
| Autor: | Zhi-Hao Liang, Cheng, Y.T., Hsu, W., Yuh-Wen Lee |
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| Zdroj: | 2004 Proceedings 54th Electronic Components & Technology Conference (IEEE Cat. No.04CH37546); 2004, p1486-1486, 1p |
| Databáze: | Complementary Index |
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