Vibration and thermo-mechanical durability assessments in advanced electronic package interconnects.
| Autor: | Wong, T.E., Fenger, H.S. |
|---|---|
| Zdroj: | 2004 Proceedings 54th Electronic Components & Technology Conference (IEEE Cat. No.04CH37546); 2004, p1080-1080, 1p |
| Databáze: | Complementary Index |
| Externí odkaz: |
|