Underfill characterization for low-k dielectric / Cu interconnect IC flip-chip package reliability.
| Autor: | Pei-Haw Tsao, Chender Huang, Mirng-Ji Lii, Su, B., Nun-Sian Tsai |
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| Zdroj: | 2004 Proceedings 54th Electronic Components & Technology Conference (IEEE Cat. No.04CH37546); 2004, p767-767, 1p |
| Databáze: | Complementary Index |
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