Board level reliability study on three-dimensional thin stacked package.
| Autor: | Jin-Young Kim, Won-Joon Kang, Yoon-Hyun Ka, Yong-Joon Kim, Eun-Sook Sohn, Sung-Su Park, Jae-Dong Kim, Choon-Heung Lee, Yoshida, A., Syed, A. |
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| Zdroj: | 2004 Proceedings 54th Electronic Components & Technology Conference (IEEE Cat. No.04CH37546); 2004, p624-624, 1p |
| Databáze: | Complementary Index |
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