Challenges of small form factor 0402 and 0201 die side capacitor assembly process on high density interconnect flip chip substrate.
| Autor: | Loke, C.C., Chin-Thong Cheong, Hun-Song Goh, Wagiman, A.N.R. |
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| Zdroj: | 2004 Proceedings 54th Electronic Components & Technology Conference (IEEE Cat. No.04CH37546); 2004, p342-342, 1p |
| Databáze: | Complementary Index |
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