An overview of packaging and characterization results of pixel multichip modules at Fermilab.
| Autor: | Cardoso, G., Turqueti, M.A., Andresen, J., Appel, J.A., Christian, D.C., Chramowicz, J., Deuerling, G., Hoff, J.R., Kwan, S.W., Mekkaoui, A., Prosser, A.G., Uplegger, L., Yarema, R. |
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| Zdroj: | IEEE Nuclear Science Symposium Conference Record, 2005; 2005, p819-822, 4p |
| Databáze: | Complementary Index |
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