Interconnections in Multilayer PCBs Based on Microvias Metallized by Magnetron Sputtering Deposition.
| Autor: | Borecki, J., Felba, J., Gromek, J., Posadowski, W.M. |
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| Zdroj: | 2006 1st Electronic Systemintegration Technology Conference; 2006, p525-531, 7p |
| Databáze: | Complementary Index |
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