Reliability and thermal structure design for CMOS image sensor.
| Autor: | Hsiang-Chen Hsu, Hui-Yu Lee, Yu-Chia Hsu, Shen-Li Fu, Chung-Chi Yang, Kuan-Chieh Huang |
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| Zdroj: | 2005 7th Electronic Packaging Technology Conference; 2005, p5-5, 1p |
| Databáze: | Complementary Index |
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