High-speed mechanical impact reliability of solder interconnections in high-power LEDs.
| Autor: | Hokka, J., Caers, J.F.J.M., Zhao, X.J., De Jong, M., Peels, W., Sykes, B., Zhang, G.Q., Paulasto-Krockel, M. |
|---|---|
| Zdroj: | 2010 11th International Conference on Thermal, Mechanical & Multi-Physics Simulation & Experiments in Microelectronics & Microsystems (EuroSimE); 2010, p1-5, 5p |
| Databáze: | Complementary Index |
| Externí odkaz: |
|