Interfacial strength of Silicon-to-Molding Compound changes with thermal residual stress.
| Autor: | Schlottig, G., An Xiao, Pape, H., Wunderle, B., Ernst, L.J. |
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| Zdroj: | 2010 11th International Conference on Thermal, Mechanical & Multi-Physics Simulation & Experiments in Microelectronics & Microsystems (EuroSimE); 2010, p1-5, 5p |
| Databáze: | Complementary Index |
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