Parametric thermal modeling of 3D stacked chip electronics with interleaved solid heat spreaders.
| Autor: | Gerlach, D.W., Joshi, Y.K. |
|---|---|
| Zdroj: | Thermal & Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006 (ITHERM 2006); 2006, p1208-1212, 5p |
| Databáze: | Complementary Index |
| Externí odkaz: |
|