Novel Ni-based ohmic contacts to n-SiC for high temperature and high power device applications.
| Autor: | Cole, M.W., Demaree, J.D., Hubbard, C.W., Wood, M.C., Ervin, M.H. |
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| Zdroj: | Proceedings IEEE Lester Eastman Conference on High Performance Devices; 2002, p65-74, 10p |
| Databáze: | Complementary Index |
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