Engineering gap fill, microstructure and film composition of electroplated copper for on-chip metallization.
| Autor: | Dubin, V.M., Thomas, C.D., Baxter, N., Block, C., Chikarmane, V., McGregor, P., Jentz, D., Hong, K., Hearne, S., Zhi, C., Zierath, D., Miner, B., Kuhn, M., Budrevich, A., Simka, H., Shankar, S. |
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| Zdroj: | Proceedings of the IEEE 2001 International Interconnect Technology Conference (Cat. No.01EX461); 2001, p271-273, 3p |
| Databáze: | Complementary Index |
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