Film properties and integration of a variety of FSG films.

Autor: Wistrom, R., Bomberger, G., Cohen, S., Hazel, S., Lavoie, M., Gambino, J., Poley, D., Dokumaci, O.
Zdroj: Proceedings of the IEEE 2001 International Interconnect Technology Conference (Cat. No.01EX461); 2001, p168-170, 3p
Databáze: Complementary Index