Film properties and integration of a variety of FSG films.
Autor: | Wistrom, R., Bomberger, G., Cohen, S., Hazel, S., Lavoie, M., Gambino, J., Poley, D., Dokumaci, O. |
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Zdroj: | Proceedings of the IEEE 2001 International Interconnect Technology Conference (Cat. No.01EX461); 2001, p168-170, 3p |
Databáze: | Complementary Index |
Externí odkaz: |