Weibull statistics of silicon die fracture.
| Autor: | Bohm, C., Hauck, T., Juritza, A., Muller, W.H. |
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| Zdroj: | Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971); 2004, p782-786, 5p |
| Databáze: | Complementary Index |
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