Chip-in-substrate package, CiSP, technology.
| Autor: | Yu-Hua Chen, Jyh-Rong Lin, Shoulung Chen, Cheng-Ta Ko, Tzu-Ying Kuo, Chien-wei Chien, Shan-Pu Yu, Ostmann, A., Neumann, A. |
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| Zdroj: | Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971); 2004, p595-599, 5p |
| Databáze: | Complementary Index |
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