Realization of LTCC modules for broadband applications.
Autor: | Chua, K.M., Lu, A.C.W., Lin Jin, Wei Fan, Wong, S.C.K. |
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Zdroj: | Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971); 2004, p235-239, 5p |
Databáze: | Complementary Index |
Externí odkaz: |