Realization of LTCC modules for broadband applications.

Autor: Chua, K.M., Lu, A.C.W., Lin Jin, Wei Fan, Wong, S.C.K.
Zdroj: Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971); 2004, p235-239, 5p
Databáze: Complementary Index