Fabrication of ultra thick, ultra high aspect ratio microcomponents by deep and ultra deep X-ray lithography.

Autor: Jian, L., Loechel, B., Scheunemann, H.-U., Bednarzik, M., Desta, Y.M., Goettert, J.
Zdroj: Proceedings International Conference on MEMS, NANO & Smart Systems; 2003, p10-14, 5p
Databáze: Complementary Index