FIB sample preparation for TEM failure analysis of advanced devices.
| Autor: | Zhu, J., Wang, Q.X., Chen, C.Q., Neo, S.P., Du, A.Y., Hua, Y.N. |
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| Zdroj: | 2010 17th IEEE International Symposium on the Physical & Failure Analysis of Integrated Circuits (IPFA); 2010, p1-5, 5p |
| Databáze: | Complementary Index |
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