High-density (4.4F2) NAND flash technology using Super-Shallow Channel Profile (SSCP) engineering.

Autor: Arai, F., Arai, N., Satoh, S., Yaegashi, T., Kamiya, E., Matsunaga, Y., Takeuchi, Y., Kamata, H., Shimizu, A., Ohtami, N., Kai, N., Takahashi, S., Moriyama, W., Kugimiya, K., Miyazaki, S., Hirose, T., Meguro, H., Hatakeyama, K., Shimizu, K., Shirota, R.
Zdroj: International Electron Devices Meeting 2000. Technical Digest. IEDM (Cat. No.00CH37138); 2000, p775-778, 4p
Databáze: Complementary Index