Integration and optimization of embedded-sige, compressive and tensile stressed liner films, and stress memorization in advanced SOI CMOS technologies.
| Autor: | Horstmann, M., Wei, A., Kammler, T., Hontschel, J., Bierstedt, H., Feudel, T., Frohberg, K., Gerhardt, M., Hellmich, A., Hempel, K., Hohage, J., Javorka, P., Klais, J., Koerner, G., Lenski, M., Neu, A., Otterbach, R., Press, P., Reichel, C., Trentsch, M. |
|---|---|
| Zdroj: | IEEE International Electron Devices Meeting, 2005. IEDM Technical Digest; 2005, p233-236, 4p |
| Databáze: | Complementary Index |
| Externí odkaz: |
|