A de-embedding technique for interconnects.
| Autor: | Jiming Song, Feng Ling, Flynn, G., Blood, W., Demircan, E. |
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| Zdroj: | IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565); 2001, p129-132, 4p |
| Databáze: | Complementary Index |
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