Challenges for the integration of metal gate electrodes.
| Autor: | Schaeffer, J.K., Capasso, C., Fonseca, L.R.C., Samavedam, S., Gilmer, D.C., Liang, Y., Kalpat, S., Adetutu, B., Tseng, H.-H., Shiho, Y., Demkov, A., Hegde, R., Taylor, W.J., Gregory, R., Jiang, J., Luckowski, E., Raymond, M.V., Moore, K., Triyoso, D., Roan, D. |
|---|---|
| Zdroj: | IEDM Technical Digest. IEEE International Electron Devices Meeting, 2004; 2004, p287-290, 4p |
| Databáze: | Complementary Index |
| Externí odkaz: |
|