Polysilicon interconnections (FEOL): Fabrication and characterization.

Autor:	Agarwal, A., Murthy, R.B., Lee, V., Viswanadam, G.
Zdroj:	11th Electronics Packaging Technology Conference, 2009. EPTC '09; 2009, p317-320, 4p
Databáze:	Complementary Index
Externí odkaz:	Zobrazit plný text záznamu