Evaluating the effects of electromigration by using adjustable solder joints of concave shape.
| Autor: | Jaeschke, J., Kleff, J., Muller, W.H., Nissen, N.F., Reichl, H. |
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| Zdroj: | 11th Electronics Packaging Technology Conference, 2009. EPTC '09; 2009, p395-400, 6p |
| Databáze: | Complementary Index |
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