Damage mechanics of solder/IMC interface fracture in Pb-free solder interconnects.

Autor:	Lai Zheng Bo, Keat, L.W., Tamin, M.N.
Zdroj:	11th Electronics Packaging Technology Conference, 2009. EPTC '09; 2009, p731-736, 6p
Databáze:	Complementary Index
Externí odkaz:	Zobrazit plný text záznamu