Sensitivity analysis of Pb free reflow profile parameters toward flip chip on silicon assembly yield, reliability and intermetallic compound characteristics.
| Autor: | Li, Zhaozhi, Lee, Sangil, Lewis, Brian J., Houston, Paul N., Baldwin, Daniel F., Stout, Gene, Tessier, Ted, Evans, John L. |
|---|---|
| Zdroj: | 2010 Proceedings 60th Electronic Components & Technology Conference (ECTC); 2010, p1132-1138, 7p |
| Databáze: | Complementary Index |
| Externí odkaz: |
|