Enabling 10µm pitch hybrid Cu-Cu IC stacking with Through Silicon Vias.
| Autor: | Huyghebaert, Cedric, Van Olmen, Jan, Chukwudi, Okoro, Coenen, Jens, Jourdain, Anne, Van Cauwenberghe, Marc, Agarwahl, Rahul, Phommahaxay, Alain, Stucchi, Michele, Soussan, Philippe |
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| Zdroj: | 2010 Proceedings 60th Electronic Components & Technology Conference (ECTC); 2010, p1083-1087, 5p |
| Databáze: | Complementary Index |
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