Cu pillars on substrates — a low cost alternative for the next generation of Flip Chip packaging technology.
| Autor: | Gupta, D., Sato, H., Nakadaira, Y. |
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| Zdroj: | 2010 Proceedings 60th Electronic Components & Technology Conference (ECTC); 2010, p1422-1428, 7p |
| Databáze: | Complementary Index |
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