Solutions for 45/40nm ELK device integration into Flip Chip and Wire Bond packaging.
| Autor: | Beleran, John, Hong, Tan Hua, Wilson, Ong Pl, Zhang, X R, Amurao, Gatbonton Librado, Mehta, Gaurav, Zhu, Wh |
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| Zdroj: | 2010 Proceedings 60th Electronic Components & Technology Conference (ECTC); 2010, p1604-1612, 9p |
| Databáze: | Complementary Index |
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