Characterization of microprocessor chip stress distributions during component packaging and thermal cycling.
| Autor: | Roberts, Jordan, Hussain, Safina, Rahim, M. Kaysar, Motalab, Mohammad, Suhling, Jeffrey C., Jaeger, Richard C., Lall, Pradeep, Zhang, Ron |
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| Zdroj: | 2010 Proceedings 60th Electronic Components & Technology Conference (ECTC); 2010, p1281-1295, 15p |
| Databáze: | Complementary Index |
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