3D chip stacking & reliability using TSV-micro C4 solder interconnection.
| Autor: | Au, K. Y., Kriangsak, S. L., Zhang, X. R., Zhu, W. H., Toh, C. H. |
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| Zdroj: | 2010 Proceedings 60th Electronic Components & Technology Conference (ECTC); 2010, p1376-1384, 9p |
| Databáze: | Complementary Index |
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