A methodology for reliability prediction: Thermal and RF MEMS case of studies.

Autor: Matmat, M., Boukabache, H., Marty, A., Esteve, D., Escriba, C., Fourniols, J.Y.
Zdroj: 2011 IEEE Sensors; 2011, p1677-1680, 4p
Databáze: Complementary Index