Toward a better understanding of morphology changes in solders using phase field theories: Quantitative modeling and experimental verification.

Autor: Brodie, D.S., Gunn, A.J., Muller, W.H., Reuben, R.L.
Zdroj: 4th Electronics Packaging Technology Conference, 2002; 2002, p404-409, 6p
Databáze: Complementary Index