Non-destructive analysis on flip chip package with TDR (time domain reflectometry) and SQUID (superconducting quantum interference device).
| Autor: | Lihong Cao, Chong, H.B., Chin, J.M., Master, R.N. |
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| Zdroj: | 4th Electronics Packaging Technology Conference, 2002; 2002, p50-55, 6p |
| Databáze: | Complementary Index |
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