Thermal effects modeling of multi-fingered MOSFETs based on new specific test structures.

Autor: Hniki, S., Bertrand, G., Ortolland, S., Minondo, M., Rauber, B., Raynaud, C., Giry, A., Bon, O., Jaouen, H., Morancho, F.
Zdroj: 2009 Proceedings of the European Solid State Device Research Conference; 2009, p296-299, 4p
Databáze: Complementary Index