Thermal effects modeling of multi-fingered MOSFETs based on new specific test structures.
Autor: | Hniki, S., Bertrand, G., Ortolland, S., Minondo, M., Rauber, B., Raynaud, C., Giry, A., Bon, O., Jaouen, H., Morancho, F. |
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Zdroj: | 2009 Proceedings of the European Solid State Device Research Conference; 2009, p296-299, 4p |
Databáze: | Complementary Index |
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