Underfill study for large dice flip chip packages.
| Autor: | Lin, A., Li, C., Meng-Kai Shih, Yi-Shao Lai, Appelt, B., Tseng, A. |
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| Zdroj: | 2009 International Conference on Electronic Packaging Technology & High Density Packaging; 2009, p40-45, 6p |
| Databáze: | Complementary Index |
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