The electrical, mechanical properties of through-silicon-via insulation layer for 3D ICs.
| Autor: | Sang-Woon Seo, Jae-Hyun Park, Min-Seok Seo, Gu-Sung Kim |
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| Zdroj: | 2009 International Conference on Electronic Packaging Technology & High Density Packaging; 2009, p64-67, 4p |
| Databáze: | Complementary Index |
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