Comparative study of interfacial reactions of High-Sn lead-free solders on single crystal Cu and on polycrystalline Cu.
Autor: | Yipeng Cui, Mingliang Huang |
---|---|
Zdroj: | 2009 International Conference on Electronic Packaging Technology & High Density Packaging; 2009, p593-596, 4p |
Databáze: | Complementary Index |
Externí odkaz: |