Comparative study of interfacial reactions of High-Sn lead-free solders on single crystal Cu and on polycrystalline Cu.
| Autor: | Yipeng Cui, Mingliang Huang |
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| Zdroj: | 2009 International Conference on Electronic Packaging Technology & High Density Packaging; 2009, p593-596, 4p |
| Databáze: | Complementary Index |
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