Post-CMOS packaging methods for integrated biosensors.

Autor: Dandin, M., Im Deok Jung, Piyasena, M., Gallagher, J., Nelson, N., Urdaneta, M., Artis, C., Abshire, P., Smela, E.
Zdroj: 2009 IEEE Sensors; 2009, p795-798, 4p
Databáze: Complementary Index