Investigation and comparison of thermal distribution in synchronous and asynchronous 3D ICs.
| Autor: | Hollosi, B., Tao Zhang, Nair, R.S.P., Yuan Xie, Jia Di, Smith, S. |
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| Zdroj: | 2009 IEEE International Conference on 3D System Integration; 2009, p1-5, 5p |
| Databáze: | Complementary Index |
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