Electrical behavior on packaging module for the novel photoelectric sensor.
| Autor: | Han, J.Q., Wang, Y.P., Guo, F.M., Xu, B., Xiong, D.Y., Zhou, M.C., Ye, Y.C., Zhu, Z.Q., Chu, J.H. |
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| Zdroj: | 2010 5th IEEE International Conference on Nano/Micro Engineered & Molecular Systems (NEMS); 2010, p233-236, 4p |
| Databáze: | Complementary Index |
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