High power electronics package: From modeling to implementation.
| Autor: | Yuan, C., Kregting, R., Huaiyu Ye, van Driel, W., Gielen, S., Zhang, G.Q. |
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| Zdroj: | Microsystems, Packaging, Assembly & Circuits Technology Conference (IMPACT), 2011 6th International; 2011, p249-252, 4p |
| Databáze: | Complementary Index |
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