Leadless IC package with a substrate produced by copper/nickel/copper-3-layer-clad material.
| Autor: | Okayama, H., Nanbu, K., Kurokawa, T., Koushiro, T. |
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| Zdroj: | Microsystems, Packaging, Assembly & Circuits Technology Conference (IMPACT), 2011 6th International; 2011, p33-36, 4p |
| Databáze: | Complementary Index |
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