Process and characterization of ultra-thin film packages.

Autor: Tzu-Ying Kuo, Zhi-Cheng Hsiao, Yin-Po Hung, Wei Li, Kuo-Chyuan Chen, Chao-Kai Hsu, Cheng-Ta Ko, Yu-Hua Chen
Zdroj: Microsystems, Packaging, Assembly & Circuits Technology Conference (IMPACT), 2010 5th International; 2010, p1-4, 4p
Databáze: Complementary Index