Process and characterization of ultra-thin film packages.
Autor: | Tzu-Ying Kuo, Zhi-Cheng Hsiao, Yin-Po Hung, Wei Li, Kuo-Chyuan Chen, Chao-Kai Hsu, Cheng-Ta Ko, Yu-Hua Chen |
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Zdroj: | Microsystems, Packaging, Assembly & Circuits Technology Conference (IMPACT), 2010 5th International; 2010, p1-4, 4p |
Databáze: | Complementary Index |
Externí odkaz: |